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SIPLACE SX 为异型板贴装尺寸长达910 mm

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Combining these options enables electronics manufacturers to produce even products with extreme dimensions reliably and efficiently on SIPLACE SX lines. “The new SIPLACE Long Board 910 functionality underscores the flexibility of our SIPLACE SX Capacity-on-Demand platform. It further enhances our customers’ investment protection and makes these state-of-the-art placement machines especially attractive for the many specialists among electronics manufacturers who have found their niche in the production of exotic modules, i.e. highly demanding PCBs in small to medium-sized lots,” says SIPLACE product manager, Petra Klein-Gunnewigk, about the wide range of customers who will potentially benefit from the SIPLACE SX's options.

 

 



SIPLACE product manager, Petra Klein-Gunnewigk, holds a board, which can be produced with the new SIPLACE Long Board 910 functionality.

ASM Assembly Systems

At the beginning of 2011, the SIPLACE team (formerly Siemens Electronics Assembly Systems) became a business unit of ASM Pacific Technology and operates now as ASM Assembly Systems. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology (SMT) placement machines and solutions. Since its beginnings in 1985, the company has installed almost 25,000 placement machines at over 2,500 customers all over the world. Electronics manufacturers in all industries such as telecommunications, automotive, IT, consumer electronics and automation use and depend on SIPLACE's broad portfolio of solutions and services.


For more information about ASM Assembly Systems (SIPLACE), please visit www.siplace.com.


ASM Pacific Technology

As a subsidiary of ASM International based in Almere, Netherlands, ASM Pacific Technology (ASMPT), Hong Kong, has developed in only a few years into the world’s leading supplier of chip assembly, bonding and packaging systems and solutions. The ASMPT Group produces and markets machines for front-end and back-end chip assembly and semiconductor packaging. The company has plants in Hong Kong, China, Singapore and Malaysia, and since January 1, 2011 in Germany. ASMPT has been listed on the Hong Kong Stock Exchange since 1989.



ASMPT is one of the stocks in the Hang Seng HK MidCap Index under the Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, and the Hang Seng Hong Kong 35 Index.

 
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