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Compatible
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Assembleon ACM, FCM-II, GEMXi, MG-1, MG-8
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Fuji NXT
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Panasonic BM(all), IPAC, MSF
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Siemens CF, CS, HF，HS50, HS55, HS60,S25,S27
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Siemens X (with Schultz Interface)
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Universal Advantis，Genesis，GSM (all)，Polaris
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Yamaha YG100, YV100
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Features:
- Eliminates separate production lines for SMT, bare die, flip chip, by combining them into one process
- Enabling total assembly solutions with much higher speed and flexibility resulting in lower cost per placement
- Eliminates costly, non value added packaging processes such as tape and reel, surf tape or waffle packs prior to placement
The Direct Die Feeder from Hover-Davis is a paradigm shift in technology that allows the SMT and bare die process to be combined. Imagine reducing capital equipment costs and increasing floor space by converging these processes that enable higher placement speeds and overall cost savings. The DDF Ultra simplifies die feeding by vertically locating the wafer and using its vision system to locate and extract only known good die from the wafer, the die are then transferred via a high speed shuttle for pick up and placement.
Ideal for the following applications: Semiconductor Components, including SiP; Hybrid circuits and sensors; Multi-Chip Modules; MEMS; 3-D Assemblies; RFID Tags
Ideal for the following applications: Semiconductor Components, including SiP; Hybrid circuits and sensors; Multi-Chip Modules; MEMS; 3-D Assemblies; RFID Tags
| Speed | Up to 5000 cph, flip chip * Up to 3500 cph, direct die * application dependant |
| Die Size | 0.5mm to 5.0mm * Down to 0.065mm - 2mm thickness * Larger die and high aspect ratio up to 27mm Optional |
| Wafer Size | Up to 200mm diameter |
| Dimensions | Height: 1162mm Length: 1125mm Width: 120mm Weight: 39kg |
