理想状况Target Condition
1.無任何錫珠、錫渣殘留於
PCB。
1.No solder ball and solder dross leave on PCB
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允收状况13 Accept Condition
1.錫珠、錫渣不論可被剝除者或不易被剝除者,直徑D或長度L≦10mil。(D,L≦10mil)
1.The diameter of solder ball / solder dross which can remove or not shall small than 10 mil
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拒收状况13 Reject Condition
1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長度L>10mil。(D,L>10mil)(MI)且<10mil每平方英寸不得超過5顆
2.Whichever is rejected.