理想状况Target Condition
1.引線腳的側面,腳跟吃錫良好
2.引線腳與板子焊墊間呈現凹面
焊錫帶。
3.引線腳的輪廓清楚可見。
1.side face and footprint have good solder fillet
2.concave fillet between land and lead
3.the shape(profile)of lead be clearly visible
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允收状况5 Accept Condition
1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。
2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。
(h≧1/2T) 。
3.腳跟(Heel)沾錫角需<90度。
1.Width of solder fillet between lead and land(X) shall over 2/3 lead footprint(L)
2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel
3.Wetting angle ＜90∘on heel
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拒收状况5 Reject Condition
1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。
2.腳跟(Heel)焊錫帶涵蓋高度 h小於零件腳1/2厚度(h<1/2T) 。
3.腳跟(Heel)沾錫角≧90度。(MI)
4.Whichever is rejected