IPC标准资料
●IPC-SC-60A锡焊后溶剂清洗手册
●IPC-SA-61锡焊后半水溶剂清洗手册
●IPC-AC-62A锡焊后水溶液清洗手册
●IPC-CH-65A印制板及组装件清洗导则
●IPC-FC-234单面和双面印制电路压敏胶粘剂组装导则
●IPC-FA-251单面和双面挠性电路组装导则
●IPC-D-279高可靠表面安装印制板组装件技术设计导则$Page_Split$
●IPC-A-311照相版制作和使用的过程控制
●IPC-D-316高频设计导则
●IPC-D-317A采用高速技术电子封装设计导则
●IPC-C-406表面安装连接器设计及应用导则
●IPC-CI-408使用无焊接表面安装连接器设计及应用导则
●IPC-TR-579印制板中小直径镀覆孔可靠性评价联合试验
●IPC-A-600F印制板验收条件
●IPC-QE-605印制板质量评价$Page_Split$
●IPC-A-610C印制板组装件验收条件
●IPC-AI-641A焊点自动检验系统用户指南
●IPC-TM-650试验方法手册
●IPC-ET-652未组装印制板电测试要求和指南
●IPC-PE-740A印制板制造和组装的故障排除
●IPC-CM-770D印制板元件安装导则
●IPC-SM-780以表面安装为主的元件封装及互连导则$Page_Split$
●IPC-SM-782A表面安装设计及连接盘图形标准（包括修订1和2）
●IPC-SM-784芯片直装技术实施导则
●IPC-SM-785表面安装焊接件加速可靠性试验导则
●IPC-SM-786A湿度/再流焊敏感集成电路的特性分级与处置程序
●IPC-MC-790多芯片组件技术应用导则
●IPC-S-816表面安装技术过程导则及检核表
●IPC-CA-821导热胶粘剂通用要求
●IPC-SM-839施加阻焊前及施加后清洗导则
●IPC-1131印制板印制造商用信息技术导则
●IPC/JPCA-2315高密度互连与微导通孔设计导则
●IPC-4121多层印制板用芯板结构选择导则（代替IPC-CC-110A）
●IPC/JPCA-6801积层/高密度互连的术语和定义、试验方法与设计例
●IPC-7095球栅阵列的设计与组装过程的实施
●IPC-7525网版设计导则$Page_Split$
●IPC-7711电子组装件的返工
●IPC-7721印制板和电子组装的修复与修正
●IPC-7912印制板和电子组装件的DPMO（每百万件缺陷数）和制造指数的计算
●IPC-9191实施统计过程控制（SPC）的通用导则
●IPC-9201表面绝缘电阻手册
●IPC-9501电子元件的印制板组装过程模拟评价（集成电路预处理）
●IPC-9502电子元件的印制板组装焊接过程导则
●IPC-9503非集成电路元件的湿度敏感度分级
●IPC-9504非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
●J-STD-012倒装芯片及芯片级封装技术的应用
●J-STD-013球栅阵列及其它高密度封装技术的应用
●IPC/EIA J-STD-026倒装芯片用半导体设计标准
●IPC/EIA J-STD-028倒装芯版面及芯片凸块结构的性能标准
●IPC/JEDEC J-STD-035非气密封装电子元件用声波显微镜$Page_Split$
●IPC-HDBK-001已焊接电子组装件的要求手册与导则
●SMC-TR-001精细节距带载自动安装技术概要
●IPC-SA-61锡焊后半水溶剂清洗手册
●IPC-AC-62A锡焊后水溶液清洗手册
●IPC-CH-65A印制板及组装件清洗导则
●IPC-FC-234单面和双面印制电路压敏胶粘剂组装导则
●IPC-FA-251单面和双面挠性电路组装导则
●IPC-D-279高可靠表面安装印制板组装件技术设计导则$Page_Split$
●IPC-A-311照相版制作和使用的过程控制
●IPC-D-316高频设计导则
●IPC-D-317A采用高速技术电子封装设计导则
●IPC-C-406表面安装连接器设计及应用导则
●IPC-CI-408使用无焊接表面安装连接器设计及应用导则
●IPC-TR-579印制板中小直径镀覆孔可靠性评价联合试验
●IPC-A-600F印制板验收条件
●IPC-QE-605印制板质量评价$Page_Split$
●IPC-A-610C印制板组装件验收条件
●IPC-AI-641A焊点自动检验系统用户指南
●IPC-TM-650试验方法手册
●IPC-ET-652未组装印制板电测试要求和指南
●IPC-PE-740A印制板制造和组装的故障排除
●IPC-CM-770D印制板元件安装导则
●IPC-SM-780以表面安装为主的元件封装及互连导则$Page_Split$
●IPC-SM-782A表面安装设计及连接盘图形标准（包括修订1和2）
●IPC-SM-784芯片直装技术实施导则
●IPC-SM-785表面安装焊接件加速可靠性试验导则
●IPC-SM-786A湿度/再流焊敏感集成电路的特性分级与处置程序
●IPC-MC-790多芯片组件技术应用导则
●IPC-S-816表面安装技术过程导则及检核表
●IPC-CA-821导热胶粘剂通用要求
●IPC-SM-839施加阻焊前及施加后清洗导则
●IPC-1131印制板印制造商用信息技术导则
●IPC/JPCA-2315高密度互连与微导通孔设计导则
●IPC-4121多层印制板用芯板结构选择导则（代替IPC-CC-110A）
●IPC/JPCA-6801积层/高密度互连的术语和定义、试验方法与设计例
●IPC-7095球栅阵列的设计与组装过程的实施
●IPC-7525网版设计导则$Page_Split$
●IPC-7711电子组装件的返工
●IPC-7721印制板和电子组装的修复与修正
●IPC-7912印制板和电子组装件的DPMO（每百万件缺陷数）和制造指数的计算
●IPC-9191实施统计过程控制（SPC）的通用导则
●IPC-9201表面绝缘电阻手册
●IPC-9501电子元件的印制板组装过程模拟评价（集成电路预处理）
●IPC-9502电子元件的印制板组装焊接过程导则
●IPC-9503非集成电路元件的湿度敏感度分级
●IPC-9504非集成电路元件的组装过程模拟评价（非集成电路元件预处理）
●J-STD-012倒装芯片及芯片级封装技术的应用
●J-STD-013球栅阵列及其它高密度封装技术的应用
●IPC/EIA J-STD-026倒装芯片用半导体设计标准
●IPC/EIA J-STD-028倒装芯版面及芯片凸块结构的性能标准
●IPC/JEDEC J-STD-035非气密封装电子元件用声波显微镜$Page_Split$
●IPC-HDBK-001已焊接电子组装件的要求手册与导则
●SMC-TR-001精细节距带载自动安装技术概要
一、设 计（Design）部分
IPC-M-106 Technology Reference for Design Manual 设计技术手册
IPC-2220 Design Standard Series 设计标准系列手册
IPC-2221A Generic Standard on Printed Board Design 印制板设计通用标准
IPC-2222 Sectional Standard on Rigid Organic Printed Boards刚性有机印制板设计分标准
IPC-2223 Sectional Design Standard for Flexible Printed Boards挠性印制板设计分标准
IPC-2224 Sectional Standard of Design of PWB for PC Card PC卡用印制电路板分设计分标准
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)及其组装件设计分标准
IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互连(HDI)印制板设计分标准
IPC-SM-782A Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 表面安装设计及连接盘图形标准(包括修订1和2)
IPC-EM-782 Surface Mount Design & Land Pattern Standard Spreadsheet表面安装设计及连接盘图形标准
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多层混合电路设计标准
IPC-1902 IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制电路网格体系
SMC-WP-004 Design for Success 成功的综合设计分析手册 $Page_Split$
IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart 印制板缺陷评估图册
IPC/JPCA-2315 Design Guide for High Density Interconnects & Microvias高密度互连(HDI)和微通孔设计指南
IPC-2615 Printed Board Dimensions and Tolerances 印制板尺寸和公差
IPC-A-311 Process Controls for Phototool Generation and Use照相版制作和使用的过程控制
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装印制板组装件技术设计导则
IPC-D-310C Guidelines for Phototool Generation and Measurement Techniques照相版制作指南和测量技术
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用标准在制板尺寸的印制板尺寸选择指南
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Back Plane压配合刚性印制背板设计指南
IPC-PWBADV-SG02 (HARD COPY)
IPC-PWB ADV-CD (CD) PCB Advanced Designer Certification Study Guide印制电路板高级设计师证书学习指南和多媒体光盘
IPC-PWB-CRT-SG01 (HARD COPY)
IPC-PWB-CERTCD1 (CD) PCB Designer Certification Study Guide 印制电路板设计师证书学习指南和多媒体光盘
IPC-2531 Standard Recipe File Format SpecificationSMEMA发布： 标准“菜单”（过程控制）文件格式规范注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}
IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication电子制造车间现场设备信息沟通(CAMX)通用要求
IPC-2546 Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印制板组装设备分要求
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 车间现场电子检验及测试设备信息沟通分要求
IPC-2571 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) 电子制造供应链信息沟通分要求 产品数据交换
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange 制成态产品-产品数据电子制造供应链信息沟通分要求
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange 材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求
IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology 实施产品制造数据描述及其传输方法学的通用要求 $Page_Split$
IPC-2501 Definition for Web-Based Exchange of XML Data XML数据网络交换定义
IPC-2511B Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML Schema Methodology实施产品制造数据描述及其网络传输方法学的通用要求
IPC-2512A Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 实施制造数据描述管理方法的分要求
IPC-2513A Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 实施制造数据描述绘制方法的分要求
IPC-2514A Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 实施印制板制造数据描述的分要求
IPC-2515A Sectional Requirements for Implementation of Bare-Board Product Testing Data Description 实施裸板成品测试数据描述的分要求
IPC-2516A Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 实施已组装板制造数据描述的分要求
IPC-2517A Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description 实施组装件在线测试数据描述的分要求
IPC-2518A Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description 实施零部件制造数据描述的分要求
IPC-D-356B Bare Board Electrical Test Data Format 裸基板电检测的数据格式$Page_Split$
二、印 制 电 路 板（Printed Circuit Boards）
IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册
IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求
IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除
IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1）
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)
IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试
IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 $Page_Split$
IPC-A-600F Acceptability of Printed Boards 印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价
IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD)
IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范
IPC-TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范
IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则
IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers钻床和铣床用计算机数字控制格式
IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则
IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要 $Page_Split$
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials高密度互连(HDI)及微导通孔材料规范
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验
IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版
IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手册, 第一期第二版
IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版
IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告
IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计
IPC-2252 Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范
IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试
IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则
IPC-M-102 Flexible Circuits Compendium 挠性电路纲要
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装 $Page_Split$
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范（包括修改单1）
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册
IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则
IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范
IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则
IPC-M-107 Standards for Printed Board Materials Manual 印制板材料标准手册
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范
IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则
IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔
IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔
IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范
IPC-TR-482 New Developments in Thin Copper Foils 薄铜箔的新发展
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study铜箔断裂强度试验联合研究结果
IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”类精纺玻璃纤维层印制板技术规范
IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法
IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1 $Page_Split$
IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范
IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系
IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺, 容量, 质量,可靠性试验标准和数据库
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则
IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南
IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性
IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 $Page_Split$
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证
IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告
IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究
三、电 子 组 装（Assembly）
IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语
IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册
IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本
IPC-TM-650 Test Methods Manual试验方法手册
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1
IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 $Page_Split$
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003 Chip Mounting Technology 芯片贴装技术
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用
IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施
IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范
IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注：
IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory)
IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则
IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute)
IPC-MC-790 Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则
IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 $Page_Split$
IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则
IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册
IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册
IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册
IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果
IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试
IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册
IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109 Component Handling Manual 元件处理手册 $Page_Split$
IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类
IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜
IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本
IPC-DRM-18F Component Identification Desk Reference Manual 零件分类标识手册
IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册
IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册
IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册
IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本
IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本
IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册
IPC-TA-723 Technology Assessment Handbook on Surface Mounting表面安装技术精选手册
IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则
IPC-PD-335 Electronic Packaging Handbook 电子封装手册
IPC-7525 Stencil Design Guidelines 网版设计导则 $Page_Split$
IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改单1）
IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1）
IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能评价手册
IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求
IPC-CA-821 General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films各向异性导电胶膜的一般要求
IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册
IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册
IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能评价手册
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法
IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820 Assembly & Joining Handbook 装联手册
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 $Page_Split$
IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施
IPC-S-816 SMT Process Guideline & Checklist 表面安装技术过程导则及检核表
IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表
IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安装导则
IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价
IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则
IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） $Page_Split$
IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包?
IPC-9850 Placement Accuracy Verification Panels? 1 IPC-9850 CMM Measurement Verification Panels?
IPC-9850 QFP-100 Glass Components? 130 IPC-9850 QFP-208 Glass Components? 150 IPC-9850 BGA-228 Glass Components? NIST Traceable Measurement Certificate? Custom Storage Case
IPC-7711/21 7711 & 7721 Package 合订本
IPC-7711 Rework of Electronic Assemblies 电子组装件的返工
IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies印制板和电子组装件的修复与修正
IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIA J-STD-003 Solderability Tests for Printed Boards 印制板可焊性试验
IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 $Page_Split$
IPC-TR-464 Accelerated Aging for Solderability Evaluations可焊性加速老化评价(附修订)
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA替代涂覆层的蒸汽老化评价
IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test技术报告: 润湿天平称重标准对比测试
SMC-WP-001 Soldering Capability White Paper Report 可焊性工艺导论
SMC-WP-005 PCB Surface Finishes 印制电路板表面清洗
IPC-M-106 Technology Reference for Design Manual 设计技术手册
IPC-2220 Design Standard Series 设计标准系列手册
IPC-2221A Generic Standard on Printed Board Design 印制板设计通用标准
IPC-2222 Sectional Standard on Rigid Organic Printed Boards刚性有机印制板设计分标准
IPC-2223 Sectional Design Standard for Flexible Printed Boards挠性印制板设计分标准
IPC-2224 Sectional Standard of Design of PWB for PC Card PC卡用印制电路板分设计分标准
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)及其组装件设计分标准
IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互连(HDI)印制板设计分标准
IPC-SM-782A Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 表面安装设计及连接盘图形标准(包括修订1和2)
IPC-EM-782 Surface Mount Design & Land Pattern Standard Spreadsheet表面安装设计及连接盘图形标准
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多层混合电路设计标准
IPC-1902 IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制电路网格体系
SMC-WP-004 Design for Success 成功的综合设计分析手册 $Page_Split$
IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart 印制板缺陷评估图册
IPC/JPCA-2315 Design Guide for High Density Interconnects & Microvias高密度互连(HDI)和微通孔设计指南
IPC-2615 Printed Board Dimensions and Tolerances 印制板尺寸和公差
IPC-A-311 Process Controls for Phototool Generation and Use照相版制作和使用的过程控制
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装印制板组装件技术设计导则
IPC-D-310C Guidelines for Phototool Generation and Measurement Techniques照相版制作指南和测量技术
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用标准在制板尺寸的印制板尺寸选择指南
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Back Plane压配合刚性印制背板设计指南
IPC-PWBADV-SG02 (HARD COPY)
IPC-PWB ADV-CD (CD) PCB Advanced Designer Certification Study Guide印制电路板高级设计师证书学习指南和多媒体光盘
IPC-PWB-CRT-SG01 (HARD COPY)
IPC-PWB-CERTCD1 (CD) PCB Designer Certification Study Guide 印制电路板设计师证书学习指南和多媒体光盘
IPC-2531 Standard Recipe File Format SpecificationSMEMA发布： 标准“菜单”（过程控制）文件格式规范注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC}
IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication电子制造车间现场设备信息沟通(CAMX)通用要求
IPC-2546 Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印制板组装设备分要求
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 车间现场电子检验及测试设备信息沟通分要求
IPC-2571 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) 电子制造供应链信息沟通分要求 产品数据交换
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange 制成态产品-产品数据电子制造供应链信息沟通分要求
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange 材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求
IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology 实施产品制造数据描述及其传输方法学的通用要求 $Page_Split$
IPC-2501 Definition for Web-Based Exchange of XML Data XML数据网络交换定义
IPC-2511B Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML Schema Methodology实施产品制造数据描述及其网络传输方法学的通用要求
IPC-2512A Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 实施制造数据描述管理方法的分要求
IPC-2513A Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 实施制造数据描述绘制方法的分要求
IPC-2514A Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 实施印制板制造数据描述的分要求
IPC-2515A Sectional Requirements for Implementation of Bare-Board Product Testing Data Description 实施裸板成品测试数据描述的分要求
IPC-2516A Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 实施已组装板制造数据描述的分要求
IPC-2517A Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description 实施组装件在线测试数据描述的分要求
IPC-2518A Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description 实施零部件制造数据描述的分要求
IPC-D-356B Bare Board Electrical Test Data Format 裸基板电检测的数据格式$Page_Split$
二、印 制 电 路 板（Printed Circuit Boards）
IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册
IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求
IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除
IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册
IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1）
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1)
IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试
IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 $Page_Split$
IPC-A-600F Acceptability of Printed Boards 印制板验收条件
IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价
IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD)
IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能
IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范
IPC-TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验
IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范
IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则
IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers钻床和铣床用计算机数字控制格式
IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则
IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要 $Page_Split$
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials高密度互连(HDI)及微导通孔材料规范
IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范
IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验
IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版
IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手册, 第一期第二版
IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版
IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告
IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计
IPC-2252 Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范
IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试
IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则
IPC-M-102 Flexible Circuits Compendium 挠性电路纲要
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装 $Page_Split$
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范（包括修改单1）
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册
IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则
IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范
IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则
IPC-M-107 Standards for Printed Board Materials Manual 印制板材料标准手册
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范
IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则
IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔
IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔
IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范
IPC-TR-482 New Developments in Thin Copper Foils 薄铜箔的新发展
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study铜箔断裂强度试验联合研究结果
IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”类精纺玻璃纤维层印制板技术规范
IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法
IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1 $Page_Split$
IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范
IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系
IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺, 容量, 质量,可靠性试验标准和数据库
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则
IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南
IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性
IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 $Page_Split$
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证
IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告
IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究
三、电 子 组 装（Assembly）
IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语
IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册
IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本
IPC-TM-650 Test Methods Manual试验方法手册
IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定)
IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求
IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1
IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比)
IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收
IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 $Page_Split$
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则
IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准
IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准
SMC-WP-003 Chip Mounting Technology 芯片贴装技术
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用
IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施
IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范
IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注：
IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory)
IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则
IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute)
IPC-MC-790 Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则
IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 $Page_Split$
IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?电路板离子洁净度测量：它告诉我们什么？
IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则
IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册
IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册
IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册
IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果
IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试
IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册
IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分
IPC-M-109 Component Handling Manual 元件处理手册 $Page_Split$
IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类
IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用
IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜
IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本
IPC-DRM-18F Component Identification Desk Reference Manual 零件分类标识手册
IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册
IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册
IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册
IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册
IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本
IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本
IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册
IPC-TA-723 Technology Assessment Handbook on Surface Mounting表面安装技术精选手册
IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则
IPC-PD-335 Electronic Packaging Handbook 电子封装手册
IPC-7525 Stencil Design Guidelines 网版设计导则 $Page_Split$
IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改单1）
IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1）
IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能评价手册
IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求
IPC-CA-821 General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films各向异性导电胶膜的一般要求
IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册
IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册
IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1)
IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能评价手册
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法
IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例
IPC-AJ-820 Assembly & Joining Handbook 装联手册
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南
IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 $Page_Split$
IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施
IPC-S-816 SMT Process Guideline & Checklist 表面安装技术过程导则及检核表
IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表
IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安装导则
IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价
IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则
IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） $Page_Split$
IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘）
IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包?
IPC-9850 Placement Accuracy Verification Panels? 1 IPC-9850 CMM Measurement Verification Panels?
IPC-9850 QFP-100 Glass Components? 130 IPC-9850 QFP-208 Glass Components? 150 IPC-9850 BGA-228 Glass Components? NIST Traceable Measurement Certificate? Custom Storage Case
IPC-7711/21 7711 & 7721 Package 合订本
IPC-7711 Rework of Electronic Assemblies 电子组装件的返工
IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies印制板和电子组装件的修复与修正
IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验
IPC/EIA J-STD-003 Solderability Tests for Printed Boards 印制板可焊性试验
IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 $Page_Split$
IPC-TR-464 Accelerated Aging for Solderability Evaluations可焊性加速老化评价(附修订)
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器温度控制稳定性联合试验
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA替代涂覆层的蒸汽老化评价
IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test技术报告: 润湿天平称重标准对比测试
SMC-WP-001 Soldering Capability White Paper Report 可焊性工艺导论
SMC-WP-005 PCB Surface Finishes 印制电路板表面清洗