Zestron和Heraeus日前宣布在合作为客户提供产品清洗工艺解决方案方面觉得里程碑式结果。
The recent round of tests evaluated ten solder pastes made of various no-clean and water-clean formulations. Among them were the high performance F377 no-clean, tin-lead solder paste and the new lead-free, halogen-free water cleanable F543. ZESTRON's VIGON A 201 and ATRON AC 205 were used in inline, batch and ultrasonic cleaning processes for the experiments. In addition to characterizing the ability to clean the solder pastes' flux residues on reflowed assemblies, the effort also examined each paste in its unreflowed state to identify the best methods of removal from stencils and misprinted circuit cards.
These tests are another installment of a long-running cooperative program in which ZESTRON develops cleaning processes for Heraeus' new soldering products in one of their state-of-the-art technical centers. The most recent effort was led by ZESTRON's Senior Process Engineer Ravi Parthasarathy at their Manassas, VA facility and was supported by Heraeus' West Conshohocken, PA, R&D organization. Other ZESTRON technical centers are located in Ingolstadt, Germany, Shanghai, China and Kulim, Malaysia, and work with Heraeus' development teams from Hanau, Germany, and Singapore.
Application bulletins for cleaning Heraeus' newest solder paste formulation are now available. They contain recommended operating parameters for inline, batch, ultrasonic, stencil and misprint cleaning.
They also include suggested concentrations, temperatures, timing and rinse information as applicable for each process. Copies of the bulletins may be obtained by contacting Ms. Dawn Lehman at Heraeus (dawn.lehman@heraeus.com) or Ms. Sabine Braun at ZESTRON (s.braun@zestronusa.com).
