当前位置: 首页 » 资讯 » SMT工艺 » 正文

iNEMI—行业无铅合金应用现状的研究报告

放大字体  缩小字体 发布日期:2009-12-23  浏览次数:377

参考资料:
[1] Yoshiharu Kariya et al. J. of Elect. Mat, 33, No. 4, 2004.
[2] C.M. Gourlay, J. Read, K. Nogita, and A.K. Dahle“The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys , Journal ofElectronic Materials, Special Issue Paper DOI: 10.1007/s11664-007-0248-8
[3] K Sweatman, S. Suenaga and T. Nishimura, Strength of Lead-free BGA Spheres inHigh Speed Loading Proceedings Pan Pacific, 2008.
[4] Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti and Bawa Singh, Drop ShockReliability of Lead-Free Alloys Effect of Micro-Additives, Proceedings 57th ElectronicComponents and Packaging Technology (ECTC), Reno, May 29-June 1, 2007.
[5] Ranjit S Pandher, Robert Healey, Reliability of Pb-Free Solder Alloys in DemandingBGA and CSP Applications, Proceedings 58th Electronic Components and PackagingTechnology (ECTC), Orlando, May 27-30, 2008.
[6] Werner Engelmaier Surface Mount Solder Joint Long-Term Reliability: Design,Testing, Prediction, Soldering and Surface Mount Technology, vol 1, no. 1, 14-22,February, 1989.
[7] J. Bartelo, et al., Thermomechanical Fatigue Behavior of Selected Pb-Free Solders,Proceedings IPC APEX 2001, LF2-2, January 14-18, 2001.
[8] N. Pan, et al., An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability UnderVarious Thermal cycle Conditions, Proceedings of SMTAI 2005, 876-883, Chicago, IL,September 2006.
[9] J. Bath, et al., Reliability Evaluations of Lead-Free SnAgCu PBGA676 ComponentsUsing Tin-Lead and Lead-Free SnAgCu Solder Paste, Proceedings of SMTAI, 891-901,Chicago, IL, September 25-29, 2005.
[10] John Manock, et al., Effect of Temperature Cycling Parameters on the Solder JointReliability of a Pb-free PBGA Package, Proceedings of SMTAI 2007, 564-573, Orlando,FL, October 2007.
[11] B. Nandagopal, et al., Study on Assembly, Rework Process, Microstructures andMechanical Strength of Backward Compatible Assembly, Proceedings of SMTAI, 861-870, Chicago, IL, September 25-29, 2005.
[12] H. McCormick et al. ,The Great Debate: Comparing the Reliability of SAC305 and SAC405 Solders in a Variety of Applications, Proceedings Pan Pacific Symposium, January 31, 2007.
[13] Unpublished results, Peter Borgeson, Unovis Consortium, November 2007.
[14] S.K. Kang et al., Evaluation of Thermal Fatigue Life and Failure Mechanisms of Sn- Ag-Cu Solder Joints with Reduced Ag Contents, Proceedings ECTC 2004, June , 2007.
[15] S. Terashima et al., Effect of Silver Content on Thermal Fatigue Life of Sn-xAg- 0.5Cu Flip-Chip Interconnects, J. Electronic Materials, Vol 32, no. 12, 2003.
[16] J. Liang, N. Dariavich, and D. Shangguan, Solidification Condition Effects on Microstructure and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder, Metallurgical and Materials Transactions A, Vol. 38A, 1530-1538, July 2007.
[17] C. Shea, et al., Low-Silver BGA Assembly Phase I Reflow Considerations and Joint Homogeneity Initial Report, Proceedings IPC APEX, April 2008.
[18] C. Shea, et al., Low-Silver BGA Assembly Phase I Reflow Considerations and Joint Homogeneity Second Report: SAC105 Spheres with Tin-Lead Paste, Proceedings SMTAI, August 2008.
[19] H. Kim, et al., Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes, Proceedings ECTC, p. 962, 2007.
[20] A. Syed, et al., Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish, Proceedings ECTC p. 951, 2007.
[21] D. Kim, et al., Evaluation of High Compliant Low Ag Solder Alloys on OSP as a Drop Solution for the 2nd Level Pb-Free Interconnection, Proceedings ECTC p. 1614, 2007.
[22] G. Henshall, et al., Manufacturability and Reliability Impacts of Pb-Free BGA Ball Alloys, Unpublished research, Hewlett-Packard, 2007.
[23] A. Syed, T. Kim, S Cha, Alternate Solder Balls for Improving Drop/Shock Reliability, Proceedings SMTAI, p. 390, 2007.
[24] Tanaka et al., Proceedings ECTC, p. 78 2006.
[25] Y-S Lai et al., Microelectronics Reliability, 46, p. 645-650, 2006.
[26] P. Snugovsky, et al., Microstructure, Defects, and Reliability of Mixed Pb Free / SnPb Assemblies, Proceedings TMS, V 1: Materials Processing and Properties p.p. 631- 642, 2008.
[27] B. Smith, P. Snugovsky, M. Brizoux, A. Grivon., Industrial Backward Solution for Lead Free Exempted AHP Electronic Products: Process Technology Fundamentals and Failure Analysis, Proceedings IPC APEX, April 2008.
[28] H. Holder, et al., Test Data Requirements for Assessment of Alternative Pb-Free Solder Alloys Proceedings SMTAI, to be published, 2008.
[29] S. Athavale, MS Dissertation, SUNY Binghamton, 2005.

(This article is Originally published in the Proceedings of the SMTA International Conference 2008)

 
[ 资讯搜索 ]  [ 加入收藏 ]  [ 告诉好友 ]  [ 打印本文 ]  [ 关闭窗口 ]

 
0条 [查看全部]  相关评论

 
推荐图文
推荐资讯
点击排行
 
网站首页 | 注册指南 | 网站制作 | 关于我们 | 联系方式 | 使用协议 | 版权隐私 | 网站地图 | 排名推广 | 广告服务 | 积分换礼 | 网站留言 | RSS订阅 | 沪ICP备09033911号-6